Ambient/ High-temp Pick & Place Handler
C6 Series Ambient/High-temp Pick & Place Handler
Can test SOT packages and the minimum chip size it can be compatible with is 1.5mm×1.5mm
It has multiple parallel test sites, test capability of high speed and high precision, and overall device protection mechanism. It is adaptive to standard kits of semiconductor test field (ensures that the kits can be swiftly switched).
Specifications
C6 Series
C6430
IC Packaging
SOP/QFN/QFP/LGA/BGA/CSP
Package Size
2mm×2mm～100mm×100mm
Device Loading/Unloading Mode
tray in /tray out
Test Site
4 site
Maximum UPH (ambient temperature)
9,500
Jam Rate
≤1/10000
Contact Force
Max. 120Kgf
Temperature Range & Accuracy
50℃~90℃±2℃ | 90℃~150℃±3℃
Communication Interface
TTL, GPIB, RS-232, TCP/IP
Equipment Dimensions
1,800mm×1,450mm×1,860mm
C6800
IC Packaging
SOP/QFN/QFP/LGA/BGA/CSP
Package Size
2mm×2mm～100mm×100mm
Device Loading/Unloading Mode
tray in /tray out
Test Site
8 site
Maximum UPH (ambient temperature)
1,300
Jam Rate
≤1/10000
Contact Force
Max.240Kgf
Temperature Range & Accuracy
1,960mm×1,540mm×2,000mm
Communication Interface
TTL, GPIB, RS-232, TCP/IP
Equipment Dimensions
1,800mm×1,450mm×1,860mm
C6160
IC Packaging
SOP/QFN/QFP/LGA/BGA/CSP
Package Size
2mm×2mm～100mm×100mm
Device Loading/Unloading Mode
tray in /tray out
Test Site
16/32 site(option)
Maximum UPH (ambient temperature)
1,450
Jam Rate
≤1/10000
Contact Force
Max. 480Kgf
Temperature Range & Accuracy
50℃~90℃±2℃ | 90℃~150℃±3℃
Communication Interface
TTL, GPIB, RS-232, TCP/IP
Equipment Dimensions
2,350mm×1,820mm×2,240mm
IC Packaging
SOP/QFN/QFP/LGA/BGA/CSP
Package Size
2mm×2mm～100mm×100mm
Device Loading/Unloading Mode
tray in /tray out
Test Site
4 site
Maximum UPH (ambient temperature)
9,500
Jam Rate
≤1/10000
Contact Force
Max. 120Kgf
Temperature Range & Accuracy
50℃~90℃±2℃ | 90℃~150℃±3℃
Communication Interface
TTL, GPIB, RS-232, TCP/IP
Equipment Dimensions
1,800mm×1,450mm×1,860mm
IC Packaging
SOP/QFN/QFP/LGA/BGA/CSP
Package Size
2mm×2mm～100mm×100mm
Device Loading/Unloading Mode
tray in /tray out
Test Site
8 site
Maximum UPH (ambient temperature)
1,300
Jam Rate
≤1/10000
Contact Force
Max.240Kgf
Temperature Range & Accuracy
1,960mm×1,540mm×2,000mm
Communication Interface
TTL, GPIB, RS-232, TCP/IP
Equipment Dimensions
1,800mm×1,450mm×1,860mm
IC Packaging
SOP/QFN/QFP/LGA/BGA/CSP
Package Size
2mm×2mm～100mm×100mm
Device Loading/Unloading Mode
tray in /tray out
Test Site
16/32 site(option)
Maximum UPH (ambient temperature)
1,450
Jam Rate
≤1/10000
Contact Force
Max. 480Kgf
Temperature Range & Accuracy
50℃~90℃±2℃ | 90℃~150℃±3℃
Communication Interface
TTL, GPIB, RS-232, TCP/IP
Equipment Dimensions
2,350mm×1,820mm×2,240mm