Ambient/ High-temp Prober
S2000-A Ambient/High-temp Prober
Can perform electrical performance test for 8-inch or 12-inch wafers
It can perform electrical performance test for 8-inch or 12-inch wafers. It realizes a high degree of automation and has advantages of high stability, high efficiency, easy maintenance, and high space utilization.
S2000-A Ambient/High-temp Prober
Specifications
DUT Type
Logic, MCU, SOC, RF, LCD Driver, etc.
Wafer Size
200mm/300mm
Wafer Thickness
Standard: 200-1250μm; Optional: Min. 50μm
Test Site
Max. 256 site
Index Time
240ms (X: 6mm, Z: 0.5mm)
Probing Force
200kg (Max.450kg), Cable/Hard Docking/DD
Test Temperature
Ambient temperature ~ 150℃±1℃
MTBF
≥168h
Communication Interface
GPIB, RS-232
Optional Function
Inker, Taiko wafer, Class10, porous gilded chuck, low-noise chuck, APC, MES, etc.