Bare Die Test Handler
tSort High Speed Die Sorting System
An advanced die appearance inspection equipment intended for wafer-level assembly
It is an advanced die appearance inspection equipment intended for wafer-level assembly. It is applicable to devices including strip CSP, wafer-level CSP, bare chips, plastic devices and more.
tSort High Speed Die Sorting System
Specifications
IC Packaging
Strip CSP/wafer-level/bare chips/plastic devices
Loader
Stretched blue film
Unloader
Tape/tray
Silicon Wafer Size
8 in/12 in
Chip Size
0.2mm×0.4mm ~7mm×7mm
UPH
30,000 at most
Carrier Tape Width
8mm~16mm
Inspection Site
Front | Back | In-tape | 5S (optional) | IR inspection (optional) | Post-tape (optional)
3D Bump Inspection
Coplanarity/probe marks/pad quality
Inspected Item
Device size, scratches/foreign objects/lack of corners/cutting quality/mark/direction/indentation quality/indentation offset
OCR Inspection
Yes
2D Matrix
Yes
Optional
OS test | Dual tape | Rework to tape | Rework to blue film
MTBA
1h
MTBF
1,000h
Equipment Dimension
2.6m×1.6m×2.2m