Defect Inspection Equipment
Hexa Scanning and Packing Machine
Be applicable to devices whose packaging forms are QFN/LGA/BGA/QFP and more
It is a piece of appearance defect inspection equipment. With STI’s exclusive patent of 2D/3D visual inspection system, it inspects dimensions, appearance defects, marks, OCR, and more.
Specifications
Hexa Scanning and Packing Machine
IC Packaging
SOP/QFN/QFP/LGA/BGA/CSP
Package Size
2mm×2mm～100mm×100mm
Device Loading/Unloading Mode
tray in /tray out
Test Site
4 site
Maximum UPH (ambient temperature)
9,500
Jam Rate
≤1/10000
Contact Force
Max. 120Kgf
Temperature Range & Accuracy
50℃~90℃±2℃ | 90℃~150℃±3℃
Communication Interface
TTL, GPIB, RS-232, TCP/IP
Equipment Dimensions
1,800mm×1,450mm×1,860mm
Loader
Tray
Unloader
Tray/reel
IC Packaging
QFN/LGA/BGA/QFP and more
Chip Size
2mm×2mm~50mm×50mm
2D Camera Megapixels
4MP
3D Camera Megapixels
12MP
UPH
Maximum 50,000 (tray), maximum 18,000 (reel)
Inspected Item
Device size/mark/orientation/appearance (front) Device size/bottom 2D measurement/appearance (back) Ball height/coplanarity/bump height/thickness (3D)
MTBA
1h
MTBF
1,000h
Options
Front/back color camera inspection Front/back bare die inspection Passive devices (e.g. capacitor) inspection Front ball inspection Side 5S monochrome/color inspection In-tray double device inspection Post-seal appearance inspection QR code reading OCR reading judgment
Equipment Dimension
2m × 2m × 1.8m (including tape and reel and excluding 5S)
Hexa Scanning and Packing Machine
Specifications
IC Packaging
EWLB/CMOS/MEMS/LED/LENS/GLASS WAFER/GAS WAFER/COG
Loader
Bare wafer or frame wafer
Silicon Wafer Size
4 in/6 in/8 in or 6 in/8 in/12 in
Multi-lens (Front 2D)
2.5X/3.5X/5X/7.5X (optional 20X)
Lights
Light and dark fields of independent lights
Resolution
3.14um/1.57um/0.78um per pixel
Inspection Capability
2×2 pixel
3D Camera
Optional
Review Lens (Color)
Yes
Transferring Manipulator
Precise dual-arm module
OCR/QR Code
Yes
Warpage Range
2mm
Inspected Item
Wafer scratch inspection/chipping/peeling/crack/dirt/RDL open circuit/bump size and height/ residual glue/ metal residue, and more.
UPH
8 inch, 2D inspection, 2.5X, ≥90 wafers | 8 inch, 3D inspection, ≥40 wafers
MTBA
6h
MTBF
1,000h
Cleanliness Class
Class 100
Inner Cleanliness
Yes
Equipment Dimension
2.3m×1.8m×2m