NanoX-6000 Automatic Wafer Measuring System
Specifications
Wafer Size
8 in and 12 in
Cassette
8-in standard cassette, 12 in FOUP, and FOSB
Measuring Mode
Automatic Measuring
Measured Item
Critical dimension (CD), overlay/shift, EBR & dam, height, film thickness, and more.
Power
5X, 20X, 50X
3D
Repeatability ≤0.2% (0.2um min/0.6um max); precision ＜0.8% (0.2um min/0.8um max)
Film Thickness
Repeatability 2A, precision 20A, measuring range 20nm-300μm
2D
Repeatability＜0.2μm, precision 0.6μm
Code Reading
Automatic Code Reading
CPK
≥1.67
Uptime
≥97%
Underkill
0
Overkill
≤ 3%
E84 communication, OHT automatic operation, support secsgem.
MTTR
≤4 h
MTBF
≥ 250 h