cs160 series slt ambient high temp p&p handler

SLT Ambient/ High-temp Pick & Place Handler

CS160 Series SLT Ambient/High-temp Pick and Place Handler

An 8-site pick and place handler with ambient temperature and high temperature ATC function

C6800C is an 8-site pick and place handler with ambient temperature and high temperature ATC function. It loads and unloads devices automatically through trays and test electric performance. It controls temperature through the ATC function.

Specifications

CS160 Series

IC Packaging

QFN/QFP/LGA/BGA/Die/POP, etc.

Package Size

5mm×5mm~55mm×55mm

Device Loading/Unloading Mode

tray in / tray out

Test Site

16 site

Maximum UPH (ambient temperature)

2,100

MTBA

2.5h

Contact Force

Max.100kg

Temperature Range & Accuracy

50℃~90℃±2℃ | 90℃~150℃±3℃

Communication Interface

RS-232

Equipment Dimensions

2,700mm ×1,670mm ×1,880mm

IC Packaging

QFN/QFP/LGA/BGA/Die/POP, etc.

Package Size

5mm×5mm~55mm×55mm

Device Loading/Unloading Mode

tray in / tray out

Test Site

12 site

Maximum UPH (ambient temperature)

2,100

MTBA

2.5h

Contact Force

Max.100kg

Temperature Range & Accuracy

50℃~90℃±2℃ | 90℃~130℃±3℃

Communication Interface

RS-232

Equipment Dimensions

2,700mm ×1,670mm×1,930mm

IC Packaging

SOP/QFN/QFP/LGA/BGA/CSP

Package Size

2mm×2mm~100mm×100mm

Device Loading/Unloading Mode

tray in /tray out

Test Site

4 site

Maximum UPH (ambient temperature)

9,500

Jam Rate

≤1/10000

Contact Force

Max. 120Kgf

Temperature Range & Accuracy

50℃~90℃±2℃ | 90℃~150℃±3℃

Communication Interface

TTL, GPIB, RS-232, TCP/IP

Equipment Dimensions

1,800mm×1,450mm×1,860mm

IC Packaging

SOP/QFN/QFP/LGA/BGA/CSP

Package Size

2mm×2mm~100mm×100mm

Device Loading/Unloading Mode

tray in /tray out

Test Site

8 site

Maximum UPH (ambient temperature)

1,300

Jam Rate

≤1/10000

Contact Force

Max.240Kgf

Temperature Range & Accuracy

1,960mm×1,540mm×2,000mm

Communication Interface

TTL, GPIB, RS-232, TCP/IP

Equipment Dimensions

1,800mm×1,450mm×1,860mm

IC Packaging

SOP/QFN/QFP/LGA/BGA/CSP

Package Size

2mm×2mm~100mm×100mm

Device Loading/Unloading Mode

tray in /tray out

Test Site

16/32 site(option)

Maximum UPH (ambient temperature)

1,450

Jam Rate

≤1/10000

Contact Force

Max. 480Kgf

Temperature Range & Accuracy

50℃~90℃±2℃ | 90℃~150℃±3℃

Communication Interface

TTL, GPIB, RS-232, TCP/IP

Equipment Dimensions

2,350mm×1,820mm×2,240mm

Specifications

CS160 Series

IC Packaging

QFN/QFP/LGA/BGA/Die/POP, etc.

Package Size

5mm×5mm~55mm×55mm

Device Loading/Unloading Mode

tray in / tray out

Test Site

16 site

Maximum UPH (ambient temperature)

2100

MTBA

2.5h

Contact Force

Max.100kg

Temperature Range & Accuracy

50℃~90℃±2℃ | 90℃~150℃±3℃

Communication Interface

RS-232

Equipment Dimensions

2,700mm ×1,670mm ×1,880mm

IC Packaging

QFN/QFP/LGA/BGA/Die/POP, etc.

Package Size

5mm×5mm~55mm×55mm

Device Loading/Unloading Mode

tray in / tray out

Test Site

12 site

Maximum UPH (ambient temperature)

2100

MTBA

2.5h

Contact Force

Max.100kg

Temperature Range & Accuracy

50℃~90℃±2℃ | 90℃~130℃±3℃

Communication Interface

RS-232

Equipment Dimensions

2,700mm ×1,670mm×1,930mm

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